The market presents opportunities in EV traction inverters with the rise of SiC & GaN devices, industrial motor drive energy efficiency, and regional diversification in Asia-PacificDublin, Jan. 21, ...
The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...
Taiwan Semiconductor remains a key component of the AI-led demand for advanced processors. Read more on how the company is ...
Professor Singisetti at the University at Buffalo discusses the commercialisation path for Gallium Oxide in high-power ...
Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the ...
(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, will announce financial ...
Interesting Engineering on MSN
Hyundai spin-off targets EV range anxiety with built-in solar panels
Solarstic, an in-house venture spun out of Hyundai Motor Group, is showcasing its vehicle-integrated ...
Penguin Solutions, Inc. announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has successfully ...
CES 2026 confirms AI connectivity and power limits, boosting Astera Labs, Inc. photonics/interconnect outlook. Click for this ...
Locally, Australia’s process automation sector—key for mining and heavy industry—stands at AU$686 million in 2025, heading to ...
The evolution of DDR5 and DDR6 represents a inflexion point in AI system architecture, delivering enhanced memory bandwidth, lower latency, and greater scalability.
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